BE BONDED
Build or repair your credit to become bondable.
Thank you for being a bonding assistance participant.
Our Bonding Program is currently in review and we are not taking any applications. Feel free to contact us if you have any questions or concerns.
Contact Jan Wehrman at 210.486.5904 or email.
CONTACT Mario E. Hernandez, M. ED., Occupational Program Coordinator,
at 210.485.0821 or email
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